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data sheet bipolar analog integrated circuit pc324 low power quad operational amplifier description the pc324 is a quad operational amplifier which is designed to operate from a single power supply over a wide range of voltages. operation from split power supplies is also possible and the power supply current drain is very low. further advantage, the input common- mode voltage can also swing to ground in the linear mode. document no. g11763ej4v0ds00 (4th edition) date published march 2004 n (cp)k printed in japan features internal frequency compensation wide output voltage swing v to v + ?.5 v common mode input voltage range includes v wide supply range 3 v to 30 v (single) 1.5 v to 15 v (split) output short circuit protection equivalent circuit (1/4 circuit) pin configuration (top view) the mark shows major revised points. ordering information part number package pc324c 14-pin plastic dip (7.62 mm (300)) pc324g2 14-pin plastic sop (5.72 mm (225)) pc324g2(5) 14-pin plastic sop (5.72 mm (225)) output v + v i i i n q 2 q 1 q 9 q 10 q 11 q 13 q 6 q 5 q 7 q 12 q 4 q 3 q 8 r sc c c 6 a 6 a 100 a 50 a 1 2 3 4 5 6 7 14 13 12 11 10 9 8 out1 i i1 i n1 v + i n2 i i2 out2 out4 i i4 i n4 v i n3 i i3 out3 14 23 + + + + pc324c, 324g2 the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. c
pc324 2 data sheet g11763ej4v0ds absolute maximum ratings (t a = 25 c) parameter symbol ratings unit voltage between v + and v note 1 v + ? ?.3 to +32 v differential input voltage v id 32 v input voltage note 2 v i v ?.3 to v +32 v output voltage note 3 v o v ?.3 to v + +0.3 v power dissipation c package note 4 p t 570 mw g2 package note 5 550 mw output short circuit duration note 6 indefinite sec operating ambient temperature t a ?0 to +80 c storage temperature t stg ?5 to + 125 c notes 1. reverse connection of supply voltage can cause destruction. 2. the input voltage should be allowed to input without damage or destruction independent of the magnitude of v + . either input signal should not be allowed to go negative by more than 0.3 v. the normal operation will establish when the both inputs are within the common mode input voltage range of electrical characteristics. 3. this specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. even during the transition period of supply voltage, power on/off etc., this specification should be kept. the output voltage of normal operation will be the output voltage swing of electrical characteristics. 4. thermal derating factor is ?.6 mw/ c when operating ambient temperature is higher than 50 c. 5. thermal derating factor is ?.5 mw/ c when operating ambient temperature is higher than 25 c. 6. pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, note 4 and note 5. recommended operating conditions parameter symbol min. typ. max. unit supply voltage (split) v 1.5 15 v supply voltage (v = gnd) v + 330v pc324c, pc324g2 electrical characteristics (t a = 25 c, v + = 5 v, v = gnd) parameter symbol conditions min. typ. max. unit input offset voltage v io r s = 0 ? 2 7mv input offset current i io 5 50 na input bias current note 7 i b 45 250 na large single voltage gain a v r l 2 k ? 25 100 v/mv supply current note 8 i cc r l = , i o = 0 a 1.0 2 ma common mode rejection ratio cmr 65 85 db supply voltage rejection ratio svr 65 100 db output voltage swing v o r l = 2 k ? (connect to gnd) 0 v + ?1.5 v common mode input voltage range v icm 0v + ?1.5 v output current (source) i o source v in + = +1 v, v in = 0 v 20 40 ma output current (sink) i o sink v in = +1 v, v in + = 0 v 10 20 ma v in = +1 v, v in + = 0 v, v o = 200 mv 12 50 a channel separation f = 1 khz to 20 khz 120 db notes 7. input bias currents flow out from ic. because each currents are base current of pnp-transistor on input stage. 8. this current flows irrespective of the existence of use.
pc324 3 data sheet g11763ej4v0ds pc324g2(5) electrical characteristics (t a = 25 c, v + = 5 v, v = gnd) parameter symbol conditions min. typ. max. unit input offset voltage v io r s = 0 ? 2 3mv input offset current i io 5 50 na input bias current note 7 i b 45 60 na large single voltage gain a v r l 2 k ? 50 100 v/mv supply current note 8 i cc r l = , i o = 0 a 1.0 1.5 ma common mode rejection ratio cmr 65 85 db supply voltage rejection ratio svr 65 100 db output voltage swing v o r l = 2 k ? (connect to gnd) 0 v + ?1.5 v common mode input voltage range v icm 0v + ?1.4 v output current (source) i o source v in + = +1 v, v in = 0 v 30 40 ma output current (sink) i o sink v in = +1 v, v in + = 0 v 15 20 ma v in = +1 v, v in + = 0 v, v o = 200 mv 30 50 a channel separation f = 1 khz to 20 khz 120 db notes 7. input bias currents flow out from ic. because each currents are base current of pnp-transistor on input stage. 8. this current flows irrespective of the existence of use.
pc324 4 data sheet g11763ej4v0ds typical performance characteristics (t a = 25 c, typ.) 1000 800 600 400 200 4 3 2 1 0 20406080100 0 10 20 30 40 t a - operating ambient temperature - c p t - total power dissipation - mw power dissipation i cc - supply current - ma supply current v + - supply voltage - v (v = gnd) t a = 20 c t a = 0 to 70 c 324g2 324c 100 75 50 25 0 10203040 v + - supply voltage - v (v = gnd) i b - input bias current - na input bias current t a = +25 c + a v + i cc 3 2 1 0 0 10 20 30 50 v io - input offset voltage - mv input offset voltage v + - supply voltage - v (v = gnd) t a = 25 c 0 40 100 50 4 3 2 1 1 0 2 3 4 5 input offset voltage v + = 5 v t a - operating ambient temperature - c 100 80 60 40 20 0 50 0 50 100 input bias current t a - operating ambient temperature - c v + = +15 v v = gnd v io - input offset voltage - mv i b - input bias current - na each 5 samples data
pc324 5 data sheet g11763ej4v0ds 140 120 100 80 60 40 20 0 1 10 100 1 k 10 k 100 k 1 m 10 m f - frequency - hz open loop frequency response a v - open loop voltage grain - db v + = 10 to 15 v v + = 30 v v + /2 v o v + v in 0.1 f 10 m ? + 20 15 10 5 0 1 k 3 5 10 k 30 50 100 k 300 500 1 m large signal frequency response v om - output voltage swing - v p-p v o v in 100 k ? 1 k ? +15 v 7 v + 2 k ? 160 120 80 40 70 60 50 40 30 0 10203040 20 60 20 80 open loop voltage gain t a - operating ambient temperature - c i o short - output short circuit current - ma output short circuit current 040 i o short + v + - supply voltage - v (v = gnd) r l = 20 k ? r l = 2 k ? f - frequency - hz a v - open voltage gain - db output sink current limit v o - output voltage - v 10 1.0 0.1 0.01 0.01 0.1 1.0 10 100 i o sink - output sink current - ma v + = 15 v + v o v + /2 v + i o sink output source current limit ? v o - output voltage to v + - v 5 4 1 0 0.01 0.1 1.0 10 100 i o source - output source current - ma + i o source v + /2 v + ? v o 3 2
pc324 6 data sheet g11763ej4v0ds 4 3 2 1 0 3 2 1 0 20406080 time - s r l 2 k ? v + = 15 v input voltage - v output voltage - v 120 100 80 60 40 20 0 100 1 k 10 k 100 k 1 m f - frequency - hz cmr - common mode rejection ratio - db common mode rejection ratio 0.2 50 0 50 100 t a - operating ambient temperature - c sr - slew rate - v/ s slew rate 0.3 0.1 0 v = 15 v v o = 10 v sr sr + voltage follower pulse response
pc324 7 data sheet g11763ej4v0ds package drawings 14-pin plastic dip (7.62 mm (300)) item millimeters a 19.22 0.2 2.14 max. f i j d 1.32 0.12 g 3.6 0.3 c b 2.54 (t.p.) 0.50 0.10 r 0~15 h 0.51 min. k 7.62 (t.p.) l 6.4 0.2 3.55 4.3 0.2 n 0.25 j b m r h g i c f dn notes 1. each lead centerline is located within 0.25 mm of its true position (t.p.) at maximum material condition. 2. ltem "k" to center of leads when formed parallel. p14c-100-300b1-3 17 14 8 m a l k m 0.25 + 0.10 ? 0.05
pc324 8 data sheet g11763ej4v0ds c d m g p detail of lead end m 1 7 14 8 f e b s k l j a h i ns item b c i 14-pin plastic sop (5.72 mm (225)) d e g h j p millimeters 1.27 (t.p.) 1.42 max. a 10.2 0.26 4.4 0.1 0.1 0.1 0.42 6.5 0.2 1.49 + 0.08 ? 0.07 1.1 0.16 3 + 7 ? 3 note each lead centerline is located within 0.1 mm of its true position (t.p.) at maximum material condition. f 1.59 + 0.21 ? 0.2 k l m n 0.6 0.2 0.17 0.1 0.10 + 0.08 ? 0.07 s14gm-50-225b, c-6
pc324 9 data sheet g11763ej4v0ds recommended soldering conditions the pc324 should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact an nec electronics sales representative. for technical information, see the following website. semiconductor device mount manual (http://www.necel.com/pkg/en/mount/index.html) surface mount device pc324g2: 14-pin plastic sop (5.72 mm (225)) process conditions symbol infrared ray reflow peak temperature: 230 c or below (package surface temperature), ir30-00-1 reflow time: 30 seconds or less (at 210 c or higher), maximum number of reflow processes: 1 time. vapor phase soldering peak temperature: 215 c or below (package surface temperature), vp15-00-1 reflow time: 40 seconds or less (at 200 c or higher), maximum number of reflow processes: 1 time. wave soldering solder temperature: 260 c or below, flow time: 10 seconds or less, ws60-00-1 maximum number of flow processes: 1 time, pre-heating temperature: 120 c or below (package surface temperature). partial heating method pin temperature: 300 c or below, heat time: 3 seconds or less (per each side of the device). caution apply only one kind of soldering condition to a device, except for ?artial heating method? or the device will be damaged by heat stress. through-hole device pc324c: 14-pin plastic dip (7.62 mm (300)) process conditions wave soldering solder temperature: 260 c or below, (only to leads) flow time: 10 seconds or less. partial heating method pin temperature: 300 c or below, heat time: 3 seconds or less (per each lead.) caution for through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered.
pc324 10 data sheet g11763ej4v0ds reference documents quality grades on nec semiconductor devices c11531e semiconductor device mount manual http://www.necel.com/pkg/en/mount/index.html nec semiconductor device reliability/ iei-1212 quality control system - standard linear ic
pc324 the information in this document is current as of march, 2004. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality, reliability and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) (1) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. (2) "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). ? ? ? ? ? ? m8e 02. 11-1

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